The editors present 44 papers that explore issues of thermal management in electronic products of a range of sizes, although the progression of shrinking system sizes is of particular concern. After the nine keynote and invited lectures the papers are organized under the following categories:
Challenges in micro- and nano-scale transport
Novel thermal management concepts
High heat flux transport
Transport in thermal management materials and across interfaces
Heat pipes and thermosyphons, compact models
Design methodologies
Analysis and testing methods
