Journal of Integrated Design & Process Science

Transactions of the SDPS

Volume

25, 4 issues

Latest issue

24:1 online 24 August 2021

Next issue

24:2 scheduled for November 2021

Back volumes

From volume 3, 1999

ISSN print

1092-0617

ISSN online

1875-8959

Aims & Scope

The Journal of Integrated Design and Process Science (JIDPS) is the official journal of the Society for Design and Process Science (SDPS). This journal publishes research findings covering transdisciplinary notions of design and process with a focus on issues that deal with 1) understanding of design and process crossing boundaries of natural, human, and built environments, 2) principles, methods, and tools, and 3) applications of design and process science to engineering, healthcare and social problems. The journal serves to promote research of transdisciplinary design and process science from different disciplines such as mathematics, computer science, economics, engineering, management science, natural sciences, and social sciences, and health science.

The journal is an archival peer-reviewed technical journal publishing the following papers: 1) research papers, 2) reports on case studies, 3) reports on major design and process projects, 4) design and process standards and proposals, 5) literature review, and 6) discussion and position papers that discuss the works published in the journal or present retrospections on critical and strategic issues in the transdisciplinary design and process science.

Editorial Board

Editor-in-Chief

Kyoung-yun Kim
Industrial and Systems Engineering
Wayne State University

Detroit, USA
E-mail: kykim@eng.wayne.edu

Co-Editors-in-Chief

Thomas Wan
Health Management and Informatics
University of Central Florida

Orlando, FL, USA
E-mail: Thomas.Wan@ucf.edu

Imre Horváth
Cyber-Physical Systems Design
Delft University of Technology

The Netherlands
E-mail: I.Horvath@tudelft.nl

Associate Editors

Eric Coatanéa
Automation Technology and Mechanical Engineering
Tampere University of Technology

Tampere, Finland
Email: 
eric.coatanea@tuni.fi

Jingwei Huang
Systems Engineering
Old Dominion University, Norfolk, USA
Email: j2huang@odu.edu

Radmila Juric
Software Engineering
The University College of Southeast Norway, Norway
Email: Radmila.Juric@usn.no

Honorary Editor

Stephen Ekwaro-Osire
Mechanical Engineering
Texas Tech University

Lubbock, USA
E-mail: stephen.ekwaro-osire@ttu.edu

Peter A. Ng
Department of Computer Science
Indiana University Purdue University Fort Wayne

Fort Wayne, USA
E-mail: ngp@ipfw.edu 

Yong Zeng
Design Science
Concordia University, Montreal

Canada
E-mail: yong.zeng@concordia.ca

Publication Manager

Jiami Yang
University of Calgary, Canada
E-mail: jiami.yang@ucalgary.ca

Editorial Board

Cliff Zintgraff
San Antonio Museum of Science and Technology (SAMSAT), San Antonio, Texas
USA

Susan McCahan
University of Toronto
Canada

Zhinan Zhang
Shanghai Jiaotong University, Shanghai
China

Tetsuo Tomiyama
Japan Educational Foundation
Japan

Joshua D. Summers
Clemson University, Clemson
USA

Martin Steinert
Norwegian University of Science and Technology (NTNU), Trondheim
Norway

Yoram Reich
Tel Aviv University, Tel Aviv
Israel

Victor Raskin
Purdue University, West Lafayette
USA

Varadraj Gurupur
University of Central Florida
USA

Ying Liu
Cardiff University, Cardiff
UK

Siyun Liu
Central China Normal University, Wuhan
China

Ohbyung Kwon
Kyung Hee University, Seoul
South Korea

Gül E. Kremer
Iowa State University
USA

Gaetano Cascini
Department of Mechanical Engineering
Italy

Roland De Guio
INSA de Strasbourg
France

Ali Hikmet Dogru
Middle East Technical University, Ankara
Turkey

Frédéric Demoly
Univ. Bourgogne Franche-Comté, UTBM
France

C.-H. Chu
National Tsing Hua University, Hsinchu
Taiwan

Amaresh Chakrabarti
Indian Institute of Science, Bangalore
IndiaE-mail: ac123@iisc.ac.in

Aurilla Aurelie Arntzen
The University College of Southeast Norway
Norway

Senior Advisory Board

Nam P. Suh
Former President of KAIST, S. Korea
Professor Emeritus, Massachusetts Institute of Technology

USA

Sang C. Suh
Computer Science
Texas A&M-Commerce, Texas, USA

Murat Tanik
Electrical Engineering
Wallace R. Bunn Chair of Telecommunications, The University of Alabama at Birmingham, USA

Raymond T. Yeh
SDPS Fellow
USA

Outreach Committee Chairs

Yuri Borgianni
Free University of Bozen, Bolzano, Italy

Serkan Guldal
Adiyaman University
Turkey

Patrick HangHui Then
Swinburne University of Technology
Malaysia

David Robbins
Samford University
USA

Fan Xiong
Bio-Rad Laboratories
USA

Xiaojuan Zhang
Wuhan University
China

Shenghuan Zhao
Suzhou University of Science and Technology
China

Author Guidelines

SUBMISSION OF MANUSCRIPT

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Submit to our online submission system at jidps.rndsphere.com

Please click here to go the Author Order Form

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Abstracted/Indexed in

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Web of Science: Emerging Sources Citation Index

Extra

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